LG Electronics Named NVIDIA Preferred Partner for Power and Cooling Solutions

Published September 28, 2026

Collaboration Reinforces LG’s Thermal Management Capabilities for High-Density AI Data Centers

News Summary

LG Electronics has joined the NVIDIA Partner Network as a Power and Cooling Solutions Preferred Partner.
LG’s data center solutions support the development of infrastructure that meets the power and thermal management requirements of next-generation AI factories.
Becoming an NVIDIA Power and Cooling Preferred Partner is a pivotal step in LG’s strategy to support the expansion of the global AI ecosystem.

ALPHARETTA, Ga., Sept. 28, 2026 — LG Electronics has joined the NVIDIA Partner Network as a Power and Cooling Solution Preferred Partner, strengthening its position in thermal management solutions for high-density AI data centers.

Together with NVIDIA, LG aims to help shape the future of AI data centers by delivering advanced cooling solutions that address the industry’s most critical thermal challenges. As AI-driven data centers require greater cooling efficiency to manage rising thermal loads, LG is expanding its B2B portfolio of highly efficient liquid cooling solutions.

LG’s data center solutions are designed to be integrated during the early stages of facility planning, providing a clear basis for the design of cooling systems and supporting infrastructure. This approach supports the delivery of infrastructure that meets the power and thermal management requirements of next-generation AI factories.

NVIDIA qualifications demonstrate LG’s expertise in liquid cooling across multiple stages of high-density AI infrastructure while highlighting the high efficiency and reliability of its liquid cooling solutions for global hyperscalers:

LG’s 2.6-megawatt (MW) Coolant Distribution Unit (CDU) has qualified as NVIDIA DSX Ready CDU and the 2.6MW CDU has the largest cooling capacity among DSX Ready CDU partners now.^* -
LG has also completed the infrastructure qualification of the 600kW and 1MW, satisfying rigorous technical criteria covering cooling performance, failover capabilities and reliability.

By the end of this year, LG plans to pursue NVIDIA qualification for its 4.0MW CDU model, reinforcing the quality of its growing portfolio of liquid cooling solutions for next-generation AI data centers.

LG’s CDUs are engineered to manage the considerable thermal demands of AI infrastructure. Implementing a direct-to-chip liquid cooling solution that delivers coolant directly to the CPU, GPU and other heat-generating components, the units operate in synergy with existing air-cooling infrastructure to create a highly efficient hybrid cooling system.

*Based on the time shown on the NVIDIA marketplace.

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LG Electronics Named NVIDIA Preferred Partner for Power and Cooling Solutions

Collaboration Reinforces LG’s Thermal Management Capabilities for High-Density AI Data Centers

News Summary

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