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LG ELECTRONICS’ 2.6-MEGAWATT COOLANT DISTRIBUTION UNIT QUALIFIES AS NVIDIA DSX READY CDU
Company Offers an Expanded Range of Large-Capacity Liquid Cooling Solutions for High-Density AI Infrastructure

News Summary
- LG Electronics has completed qualification for its 2.6-megawatt (MW) Coolant Distribution Unit (CDU), meeting the applicable NVIDIA DSX reference design requirements for DSX AI Factory Platform.
- This milestone follows the qualification of LG’s 600-kilowatt (kW) and 1-megawatt (MW) CDUs, further highlighting the company’s ability to address the growing thermal demands of high-density AI data centers.
- Designed to efficiently manage the substantial thermal loads generated by large-scale AI server clusters, the 2.6MW CDU expands LG’s comprehensive “Chip-to-Chiller” portfolio of liquid cooling solutions and high-efficiency chillers.
SINGAPORE, Oct. 2, 2026 — LG Electronics (LG) has qualified its 2.6-megawatt (MW) Coolant Distribution Unit (CDU) as NVIDIA DSX Ready CDU. The product meets the applicable NVIDIA DSX reference design requirements for AI factory infrastructure. The NVIDIA DSX AI Factory Platform unifies AI factory design and operations across compute, networking, power, cooling, facilities, and software. Qualified to meet NVIDIA functional requirements and listed on the NVIDIA DSX AI Factory Marketplace, the 2.6MW CDU expands LG’s ability to address the rapidly growing thermal management requirements of AI infrastructure.
Supporting the Growing Demands of High-Density AI Infrastructure
With next-generation AI accelerators, including NVIDIA Blackwell architecture, continuing to advance, AI server energy consumption and heat emissions are rapidly increasing. Due to server rack power density now reaching hundreds of kilowatts, demand is shifting from conventional cooling configurations deployed at the individual rack level to MW-class centralised, high-capacity CDUs capable of managing thermal loads across multiple high-density server racks.
LG has completed the infrastructure qualification of the 600kW, 1MW, and 2.6MW models. The 2.6MW model achieved the additional qualification requirements to be DSX Ready. The NVIDIA DSX AI Factory Platform unifies AI factory design and operations across compute, networking, power, cooling, facilities, and software.
With the qualification of its 2.6MW model, categorised as a ‘Large-Scale’ solution by NVIDIA, LG is further strengthening its position as a global manufacturer capable of supporting the liquid cooling CDU needs of AI factory infrastructure.
Managing Substantial Thermal Loads
A key component of a direct-to-chip (DTC) liquid cooling system, a CDU circulates coolant through cold plates to remove heat from CPUs and GPUs and transfer it to the data centre’s cooling infrastructure. LG’s 2.6MW CDU is designed to efficiently manage the substantial thermal loads generated by large-scale AI server clusters. This high-capacity solution helps data centre operators make more efficient use of available space while supporting operational continuity.
As AI infrastructure becomes increasingly power- and compute-intensive, the adoption of liquid cooling is quickly accelerating. According to global market research firm TrendForce, the market penetration of liquid cooling for AI chips is expected to rise from 14 percent in 2024 to approximately 60 percent by 2027.*
Strengthening ‘Chip-to-Chiller’ Capabilities for AI Data Centres
The qualification of the 2.6MW CDU highlights LG’s comprehensive “Chip-to-Chiller” portfolio, which addresses thermal management across the entire AI data centre cooling ecosystem.
The company’s portfolio encompasses high-efficiency chillers, Computer Room Air Handlers (CRAHs) and liquid cooling solutions designed to dissipate the heat generated by high-performance AI servers. By combining these technologies, LG is able to provide customized thermal management solutions that cover the whole cooling process, from absorbing heat at the AI chip level to ultimately rejecting that heat from the data centre facility.
“NVIDIA’s qualification of our 2.6MW CDU for AI factory infrastructure reinforces our position as a first mover in the next-generation liquid cooling market,” said James Lee, president of the LG Electronics Eco Solution Company. “We will continue to supply AI data centre operators with highly reliable, in-house developed cooling solutions from our comprehensive Chip-to-Chiller portfolio.”
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* Please refer to https://www.trendforce.com/presscenter/news/20260817-13183.html for more information
About LG Electronics Eco Solution Company
The LG Eco Solution Company (ES) offers advanced air conditioning solutions, including chillers, for diverse sectors and climates. Committed to exceptional HVAC performance, the ES Company aims to enhance indoor comfort and well-being with innovative air care products. Leveraging deep industry expertise, it offers digitalized HVAC solutions designed for better life. As a trusted partner, the company integrates cutting-edge technology into daily operations while offering ongoing support. For more information, please visit www.lg.com/sg/business/commercial-air-conditioners/.
About LG Electronics Singapore Pte Ltd
LG Electronics Singapore Pte Ltd (LG Electronics Singapore) is a fully owned subsidiary of LG Electronics Inc., the pioneer and market leader of the Korean electronics industry. LG Electronics Singapore operates four business units locally – Media Entertainment Solutions, Home Appliance Solutions, Eco Solutions, and Business Solutions. In recognition of its vision to enrich people’s life with smart technologies and innovative design, LG Electronics Singapore has been recognized with prominent local and international accolades, such as the CNET Asia Editor’s and Readers' Choice Awards, HWM+HardwareZone.com Tech Awards, Red Dot Design, and GfK No. 1 Awards. For more information, please visit www.lg.com/sg.
Media Contacts:
Cher Sok Kheng LG Electronics Singapore E-mail: sokkheng.cher@lge.com |
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